FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

Copper plating itself is mature and commonplace in the semiconductor industry for printed circuit board production. However, modern consumer products such as computers and smartphones have a useful ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...

The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...

A highly transparent, flexible, stretchable and patternable copper fiber heater was successfully fabricated for potential use in smart windows and other applications. The thickness of the electrospun ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Since the end of the Second World War the use of plastics has increased remarkably due to a systematic exploitation of their principal advantages, i.e. lightness, flexibility and toughness, ease of ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...