In 2020 flexible barrier manufacturing for flexible electronic devices such as displays will be a market worth more than US$184 million according to IDTechEx Research. That equates to 3.8 million ...

New York, Sept. 15, 2023 (GLOBE NEWSWIRE) -- Electronic board-level underfill and encapsulating material sales were projected to reach a value of around US$ 310.7 million by the end of 2022. The ...

Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, reports unprecedented results in high reliability electronics protection with ALD.

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/37k7cz/innovations_in) has announced the addition of the "Innovations in ...

As such, the Global Electronic Board Level Underfill and Encapsulation Material Market is estimated to expand at a CAGR of 5.5% by during the forecast period of 2020-2030. Key Takeaways from ...

Epoxies, Etc. develops a high performance two part silicone system. Epoxies, Etc. develops a high performance two part silicone system. 50-1225 is designed for electronic packages that require good ...