Master Bond MasterSil 152, a two-component condensation curing system, was created for potting and encapsulation applications where it is not possible to use an addition-cured silicone. The system ...

Master Bond manufactures potting and encapsulation compounds which improve performance and offer easy processing to various covering power supplies, connectors, sensors, and relays. These potting and ...

The following table summarizes Master Bond's range of adhesives, sealants, coatings, potting and encapsulation compounds for the electronics industry. Acrylic based, silver conductive, one part system ...

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry. Master Bond’s wide ...

MasterSil 151 is a two-component, low-viscosity silicone compound for high-performance casting, potting, and encapsulation applications. This material features an operating temperature range of –65° ...

A two-component epoxy/urethane elastomer, EP30DP is used for potting and encapsulation applications that require superior strength, abrasion resistance and toughness. It can be cast in thick cross ...

A new flexible, tough epoxy potting and encapsulation compound called EP30FL can be used in both thick and thin cross sections. It is 100% reactive and contains no volatiles. The compound generates ...