Abstract: This article presents the D-band characterization of General Electric’s (GE) high-purity fused-silica (HPFS) substrate processing using microstrip ring resonator (MRR) and required passive ...

WASHINGTON — 2025 produced a seemingly endless array of history-making events and nearly constant change to immigration ...

Abstract: Targeting the next-generation 4F2 DRAM and 3D stackable DRAM, we propose a multi-wordline (preferably 2-wordline) array transistor for 1T1C DRAM to efficiently minimize gate-induced drain ...